ContourX-500 – Bruker

Introducing Bruker’s Most Advanced Benchtop Design:

• Precision Automation: It is equipped with an encoded XY stage, automated tip/tilt head, and automated intensity control for unparalleled measurement precision.
• User-Friendly Interface: Intuitive software design ensures rapid, accurate results with a minimal learning curve.
• Customizable Features: Tailor a broad spectrum of automation capabilities to meet the unique demands of specialized measurement and analysis.

Optimize your workflow with this cutting-edge benchtop solution, engineered for superior efficiency and accuracy.

The ContourX-500 Optical Profilometer represents the pinnacle of automated benchtop systems, delivering rapid, non-contact 3D surface metrology with unparalleled precision. This gage-capable instrument excels with exceptional Z-axis resolution and accuracy, encapsulating the renowned benefits of Bruker’s white light interferometry (WLI) floor-standing models within a compact footprint.

Its versatile design can be effortlessly tailored to meet a broad spectrum of intricate applications. From QA/QC metrology of precision-machined surfaces and semiconductor processes to R&D characterization for ophthalmic devices and MEMS technology, the ContourX-500 is the ultimate solution for comprehensive, reliable metrology.

• Tip/Tilt Optical Head: Enables surface feature measurement across a wide range of angles while minimizing tracking errors, ensuring comprehensive and precise data acquisition.
• Advanced User Interface: Offers intuitive access to a vast collection of pre-programmed filters and analytical tools, simplifying complex analyses with streamlined workflows.
• Integrated Air Isolation: Delivers superior metrology precision within a compact footprint, maintaining measurement integrity and reducing the impact of environmental noise.

FEATURES

Bruker’s proprietary tip/tilt technology within the head offers unparalleled flexibility for production setup and inspection. By integrating the automatic tip/tilt functionality directly into the microscope head’s optical path, Bruker ensures that the inspection point remains aligned with the line of sight, regardless of tilt angle. This minimizes operator intervention and maximizes reproducibility.

Additional features include an innovative stage design that supports extensive stitching capabilities, and a 5MP camera with a 1200×1000 measurement array for reduced noise, a broader field of view, and superior lateral resolution.

Combined with automated staging and objectives, these features make the ContourX-500 the ideal choice for “measure-on-demand” R&D and industrial metrology, all within a compact and efficient footprint.

APPLICATIONS

Surface-Independent Metrology with Application-Specific Solutions

Precision Engineering

Keep the surface texture and geometric dimensions of precision-engineered parts within tight specification limits. Our gage-capable measurement systems provide efficient feedback and reporting as you monitor, track, and evaluate processes and assess GD&T conformance.

MEMS and Sensors

Perform high-throughput, highly repeatable etch depth, film thickness, step-height, and surface roughness measurements, as well as advanced critical dimension metrology of MEMS and optical MEMS. Optical profiling can characterize devices throughout the manufacturing process from wafer to final test, and even through transparent packaging.

Orthopedics/Ophthalmics

Obtain precise, repeatable measurements of implant materials and components through the complete product life cycle. Our WLI optical profilers support R&D, QA, and QC analyses, for applications ranging from characterization of surface parameters of lens and injection molds to surface finish verification and wear of medical devices.

Tribology

Measure, analyze, and control the impact of friction, wear, lubrication, and corrosion on material/component performance and lifespans. Determine quantitative wear parameters and perform fast pass/fail inspections on the widest range of shiny, smooth, or rough surfaces.

Semiconductors

Improve yield and reduce costs for both front- and back-end manufacturing processes with automated, non-contact, wafer-scale metrology systems. Perform post-CMP die flatness inspection; bump height, coplanarity, and defect identification and analysis; and measure the critical dimensions of component structures.

Optics

Better understand the root causes of defects and optimize polishing and finishing processes with accurate and repeatable sub-nm roughness measurements. Our non-contact metrology systems enable compliance with increasingly stringent specifications and ISO norms for samples ranging from small aspheric and free-form optics, to optical components with complex geometries, to diffraction gratings and microlenses.

Find out how this device has used in research publications:

• Studies on the Cooperative Influence of Cr and Mo on the Pitting Corrosion Resistance of Super Austenitic Stainless Steels. Li, B.; Lang, Y.; Chen, H.; Qu, H.; Feng, H.; Sun, X.; Tian, Z. Materials 2023, 16, 7397. https://doi.org/10.3390/ma16237397
• Ultra-resolution scalable microprinting. Vidler, C., Crozier, K. & Collins, D. Microsyst Nanoeng 9, 67 (2023). https://doi.org/10.1038/s41378-023-00537-9